TopDirect 2 Pack Heat Bed Power Module Add-on Hot Bed Power Expansion Board MOS Tube High Current Load Module for 3D Printer

Features:
Color: Black
Size: 6 x 5 x 3.1cm / 2.36 x 1.97 x 1.22″
Mounting holes: 3.2mm diameter, for M3 screws
Max Current: 25A (Enhance heat dissipation), safe for prolonged times. ensure active cooling of the heatsink.
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this).

Note:
This module under the premise of normal cooling, found at I (Max) = 25A stable work situation, the process of using the current not exceed 25A.

Package Included:
2 Set x Heated Bed Power Expansion Module Kit

Product Warranty:
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All TopDirect products provide 30 days money-back guarantee & 12-month warranty. Any questions, please don’t hesitate to contact us. We will reply you within 24 hours.

Product Features

  • Application: This high power module is a general add-on heated bed power expansion module for 3D printer. It can work with the Anet A8.
  • Motherboard: The heat bed power module can be used in both Chitu motherboard and other open 3D printer motherboards.
  • 25A MAX Current: This high power module helps your 3D printer equipped with the Chitu controller board (capable of max 15A) become even more powerful. With this add-on module to board lead the maximum current up to 25A.
  • Good Protection: When using heated bed 3D printer for 12V power supply which may cause excessive current during times, with this module, it can well protect the connectors on the controller board from burning.
  • Package: 2 Set x Heated Bed Power Expansion Module Kit (motherboard is not included).

Detailed Information available on our Homepage…

Hrph 3D Printer Heated Bed Power Module High Current 210A MOSFET Upgrade RAMPS 1.4 12V-50V

Feature:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 70*45mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 62.8*37.8mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-50V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working

Included:
1 x Heated Bed Power Module
1 x Connection cable for input signal
2 x Power Connection Cables

Product Features

  • ★.Heated bed power module.Based on powerful MOSFET HA210NO6
  • ★.Size: 70*45mm,Mounting holes: 3.2mm diameter, for M3 screws.;Distance betweeen holes: 62.8*37.8mm
  • ★. Voltage: 12V-50V; Maximum current with active cooling: 210A
  • ★. Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
  • ★. This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)

Detailed Information available on our Homepage…

gaddrt 3D Printer Heated Bed Power Module High Current 210A MOSFET Upgrade RAMPS 1.4

3D Printer Heated Bed Power Module High Current 210A MOSFET Upgrade RAMPS 1.4
Feature:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 60*50mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-24V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working
Package including:
1 x Heated Bed Power Module
1 x Connection cable for input signal

Product Features

  • his module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
  • Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
  • Voltage: 12V-24V
  • Size: 60*50mm
  • Based on powerful MOSFET HA210NO6

Visit The Website For More Information…

CALISTOUK Heat Bed Power Module MOS Tube Power Expansion Board High Current Load Module for 3D Printer

Specification:
Dimensions: 60x50mm.
Mounting holes: 3.2mm diameter, for M3 screws.
Distance between holes: 54x43mm
Voltage: 12V-24V
Maximum constant current: 25A

Package included:
1 x Heated Bed Power Module
1 x Connection cable for input signal

NO Retail Box. Packed Safely in Bubble Bag.

Product Features

  • A general heated bed power expansion module high power module for 3D printer.
  • The module is helpful for heat bed to solve the issue of overload power and current load.
  • With this headed bed expansion power module to board lead the maximum current up to 25A.The current must not exceed 25A while the process working.
  • Helps 3D printer equipped with the controller board (capable of max 15A) become more powerful.
  • It can be used in Chitu motherboard and other open 3D Printer motherboards.

Visit The Website For More Information…